DAI384 384×288 LWIR Imager | Uncooled Core, <0.7 W
DAI384 is a 384×288 uncooled LWIR module with 17 μm pixels, 50 Hz imaging and published NETD ≤40 mK at 300 K, f/1.0. Its 20×20 mm PCB weighs 12 g without a lens and draws <0.7 W from 2.5–5.5 V DC. BT.656 digital video, PAL CVBS and RS-232 support embedded integration, with optional 12, 19, 25, 35 or 50 mm lenses. The specified commercial operating range is -20°C to +60°C.
- 50 Hz
- < 0.7 W
- 12g (excluding lens)
- 20mm × 20mm (excluding lens)
- BT.656
- PAL (CVBS)
- RS-232
- 12mm, 19mm, 25mm, 35mm, 50mm, etc.
- 384 × 288 / 17μm
- ≤40mk @300K f/1.0
- DC +2.5V ～ +5.5V
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Core specifications
Technical data
| Parameter | Specification |
|---|---|
| Detector Type | Uncooled infrared microbolometer (no TEC) |
| Resolution / Pixel Pitch | 384 × 288 / 17μm |
| Sensitivity (NETD) | ≤40mk @300K f/1.0 |
| Frame Rate | 50 Hz |
| Spectral Band | 8 ～ 14μm |
| Operating Voltage | DC +2.5V ～ +5.5V |
| Power Consumption | < 0.7 W |
| Power Protection | Reverse polarity / Under & over voltage protection |
| Operating Temperature | Commercial: -20℃ ～ +60℃; Special: -40℃ ～ +60℃ |
| Storage Temperature | -45℃ ～ +65℃ |
| Humidity | 5% ～ 95% (Non-condensing) |
| Vibration & Shock Resistance | Vibration: GJB 150-16 2.3.1; Shock: GJB 150-18 Test 7 100g/6ms |
| Thermal Shock | -5℃/min (-40℃ ～ +60℃) |
| Weight | 12g (excluding lens) |
| PCB Dimensions | 20mm × 20mm (excluding lens) |
| Digital Video Interface | BT.656 |
| Analog Video Output | PAL (CVBS) |
| Communication Port | RS-232 |
| External Control | 5-key keypad |
| External Interfaces | Power input / Digital video / Communication / Analog video |
| Available Focal Lengths | 12mm, 19mm, 25mm, 35mm, 50mm, etc. |
1. Features & applications
The DAI384 is an ultra-compact shutterless uncooled infrared thermal imaging module designed for space-constrained and low-power applications. Its core advantages include an ultra-small volume of 20×20×20mm and very low power consumption under 0.7W. With shutterless technology and flexible lens/interface configurations, it is ideal for OEM integration in portable, miniaturized, and cost-effective thermal imaging systems.
2. Product Features
- Extremely Compact: Ultra-small size (20mm³) and ultra-light weight (12g).
- Ultra-low Power: Typical power consumption less than 0.7W.
- Shutterless Technology: Enhances reliability, eliminates mechanical noise, and enables faster startup.
- High Sensitivity: ≤40mk thermal sensitivity for clear image detail.
- Flexible Customization: Supports multiple lens options, digital interfaces, and communication ports to fit diverse application scenarios.
3. Application Scenarios
- Smart Security: High-sensitivity thermal detection for perimeter monitoring, intrusion alarm and backlight environments.
- Industrial Inspection: Equipment temperature monitoring and fault diagnosis in complex environments.
- Automotive and UAV: Lightweight miniaturized module for vehicle or UAV thermal payloads to realize night vision and target recognition.
- Medical and Scientific Research: Non-contact temperature measurement and small-form-factor thermal imaging in research devices.
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