Compact thermal imaging for embedded OEM systems
A compact, low-power thermal imaging module for OEM developers building portable instruments, UAV payloads and other embedded infrared systems.
Aurora Mini DSQ09 Thermal Module for Compact OEM Devices
A compact 640 × 512 uncooled thermal core with flexible MIPI, USB and CVBS outputs for space- and power-conscious OEM integrations.
DAI384 Compact Thermal Imaging Module for OEM Integration
A compact, low-power uncooled thermal imaging module with a 384 × 288 sensor, shutterless operation and flexible lens and interface options.
DA MicroPro: Compact Thermal Imaging for OEM Integration
A compact, uncooled thermal imaging module with selectable detector resolutions, low power consumption and flexible digital interfaces for OEM-designed equipment.
HI640S Uncooled Infrared Thermal Imaging Module for OEM Integration
A compact uncooled microbolometer module with 640×480 or 640×512 detectors, selectable video and serial interfaces, optional lens choices and power draw below 1.5 W for OEM thermal cameras.