HI640S Uncooled Infrared Thermal Imaging Module | Ultra-Compact 25mK Sensitivity
Dimensions
28×28×30 mm
Weight
40 grams
Sensitivity
≤25 mK
Power Consumption
<1.5 W
Operating Temp
-40°C to +60°C
Power Input
DC +4V to +12V
The HI640S Uncooled Infrared Thermal Imaging Module represents a breakthrough in compact thermal sensing technology, delivering exceptional performance in an incredibly small form factor. Measuring just 28×28×30 mm and weighing only 40 grams, this thermal imaging module packs professional-grade capabilities into a package ideal for space-constrained applications.
Advanced Features and Technical Excellence
The HI640S Uncooled Infrared Thermal Imaging Module incorporates cutting-edge technology designed for demanding thermal imaging applications. Its ultra-high sensitivity delivers superior thermal contrast that enables detection of minute temperature variations across various scenes.
Dual detector options: 640×480 17μm or 640×512 12μm
Sensitivity: ≤25 mK (12μm) or ≤40 mK (17μm) at f/1.0
Low power consumption under 1.5W
Integrated micro-shutter technology
Adaptive non-uniformity correction
Digital zoom from 1.0× to 8.0× in 0.1× steps
Multiple polarity modes (black hot, white hot, pseudo color)
Automatic and manual brightness control
Applications Across Multiple Industries
📞 Get in Touch
Website
Product Link
Phone (WhatsApp)
Origin:
uavauto.com
Related Posts
-
DAI640 Uncooled Infrared Thermal Imaging Module: Compact Powerhouse for OEM Integration
-
DAI640G Uncooled Infrared Thermal Imaging Module for Industrial and Security Applications
-
DAI640Pro: The Ultra-Compact Thermal Imaging Module for Drones and Portable Systems
-
HI640S Uncooled Infrared Thermal Imaging Module – Ultra-Compact OEM Solution
